Japan Develops New Technologies for Bonding Building Materials

A new technology for bonding residential building materials is now quietly gaining popularity in Japan. This new technology allows better recycling of building materials.
This new technology is to attach a metal film with solid adhesive on both sides to the building materials to be bonded, and then pressurize them so that the two building materials and the adhesive are tightly combined. Subsequently, the current is applied to the metal film. When the temperature of the metal film reaches about 200 degrees Celsius, the solid adhesive melts. At this time, the current is cut off, and the adhesive is cooled and solidified to achieve the purpose of bonding.
When the building needs to be rebuilt or reconstructed, the metal film is again supplied with electric current, the adhesive is again melted, and the building materials are completely separated, so that the building materials can be used again without being damaged.
The solid adhesive attached to the metal film is a polyamide resin material that can be tightly bonded to the metal. If it is a metal building material, it may be directly bonded with a tape made of the resin alone, but the metal building material must be heated.
It is believed that this new technology is well-suited for the renovation of restaurants that require frequent modifications.

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