Strip lead frame and its manufacturing method and application method in semiconductor package

【Patent Name】 Strip lead frame and its manufacturing method and method of application in semiconductor packaging 【Applicant】 Advanced Interconnect Technology Co., Ltd. [Inventor] S·Islam; R·S·San Antonio; L·C·Gulto M. [main applicant address] Mauritius Port Louis [application number] 03822835.1
【 Application Date 】 2003.09.22
[Examination and announcement number] 1777988
【 Validation announcement date 】 2006.05.24
【 Main classification number】 H01L23/31(2006.01)I
[Classification] H01L23/31(2006.01)I H01L21/68(2006.01)I H01L23/498(2006.01)I
[Priority] 2002.9.25 US 10/256,288
[Summary] 1. A strip lead frame includes: a strip; and a lead frame formed by a plurality of independent metal parts joined to the strip, and arranged in an area pattern to provide an integrated circuit chip The support and electrical connections are electrically isolated from each other on the metal parts and other metal parts of the pattern.
[Instruction CD-ROM] D0621-1
【International Application】 2003-09-22 PCT/IB2003/004632
【International Publication】 2004-04-08 WO2004/030030 【Abstracts】 The present invention provides a strip lead frame for manufacturing an electronic package. The strip lead frame is composed of a strip and a lead frame composed of a plurality of independent metal parts joined to the strip and arranged in an area pattern. Making the method of the present invention results in a significant reduction in the thickness of conventional lead frames, resulting in a thinner package, resulting in improved heat dissipation, and a shorter geometry resulting in improved electrical performance. A plurality of such leadframes are arranged in an array on a strip, and each leadframe is isolated from the chip spacers on the strips and the surrounding leadframes so that no metal components extend into the chip spacing area. The integrated circuit chip is in contact with and electrically connected to the lead frame, and an encapsulating material is used to harden and dry the lead frame and the chip spacers. Thereafter, the tape is removed and the lead frame is unitized by cutting the packaging material of the chip spacers to form a separate package. The singulation is done in the chip spacers and will not cut into any metal parts that form the lead frame.
【 Agency 】 Shanghai Patent & Trademark Office Co., Ltd. [Agent] Li Ling