High-precision silver paste holed multilayer carbon film surface mount board production process

Patent Name High-Precision Silver Pores Multilayered Carbon Film Surface Mounting Plate Production Process Patent Applicant Xu Lijun Principal Applicant Address 311300 Zhejiang Province Lin'an City Qianwang Street No. 220 Inventor Xu Lijun Application (Patent) No. 200510049477.X Date of Application 2005.03 .28 Approval Date Approval Notice No. 1665376 Approval Notice Day 2005.09.07 Instruction CD-ROM D0536 Main Classification Number H05K3/46 Classification Number H05K3/46; H05K3/42; H05K3/00 Sub-item Original Application No. Priority Abstract This invention relates to A silver paste doubled circuit board production process. The technical problem to be solved is to overcome the deficiencies of the background art and provide an improvement in the production process of the silver paste-porous multilayered carbon film surface mount board, which should have the characteristics of high product quality, short production cycle, and low production cost. The technical solution provided is: high-precision silver paste multi-layer carbon film surface mount board production process, which in turn includes blanking, drilling, printed circuit layer, printed solder mask, through-hole screen printing, printed protective layer , punch shape, electrical test, packaging process, through-hole screen printing process plus a scraping program. Add a printed carbon film process before stamping the shape process. The squeegee squeegee procedure uses a special pad at the bottom of the circuit board. After the screen is placed on the surface of the circuit board, an elastic blade is used to scrape the pressure on the back of the screen to allow the silver paste to fully enter the through hole. The pre-bake process is added prior to punching the outline program. Sovereign Items 1. High-precision silver paste multi-layer carbon film surface mount board production process, including blanking, drilling, printed circuit layer, printed solder mask, through-hole screen printing, printed protective layer, and punch The shape, electrical test, and packaging process are characterized by a scratch grouting process in the through-hole screen printing process. International Application International Publication Entering Country Date Patent Agency Hangzhou Jiuzhou Patent Office Co., Ltd. Agency Address Agent Wang Hongxin; Tang Zhengzhong