High-performance automatic RFID electronic label packaging equipment

This project is a research and development project of Shenzhen Huitian Industrial Co., Ltd. It is an automation product with independent intellectual property rights. It integrates a variety of disciplines such as computer, electricity, mathematics, vision, radio, automatic control, computer software and hardware, and semiconductor technology. It is characterized by high speed, high precision, and high intelligence. It is capable of mass production, low cost, and high cost. The key equipment in the production line of quality manufacturing electronic tags.

At present, only a handful of companies in the world are developing and selling the same equipment. At home, only Huitian is currently researching and developing and selling. The main performance indicators of the equipment have reached the international advanced level, and made breakthroughs in key technology areas, with independent property rights, which can greatly reduce the electronic packaging costs of electronic tags.

The manufacture of transponders or inlays is the key to the manufacture of electronic tags. It also has a close relationship with chip design and manufacturing, antenna design and manufacturing, reader design and manufacture, and radio frequency identification product applications. This is also reflected in this set of Packaging equipment design and manufacturing.

At present, the production line has applied for a batch of invention patents and copyrights to the country, among which a number of patents have filled our country's blank.

Breakthrough key technologies:
* Non-Newtonian fluid modeling and precise control technology in dispensing process;
* High acceleration, high precision and fast response force sensing and force/position hybrid control methods and techniques;
* High-speed and high-precision motion control guided by flight vision;
* Thermal, force, displacement and other multi-physical detection and control technology;
* Multi-module parallel detection algorithm and technology.

Technical positioning:
* Independent development, breakthrough in key technologies, providing customers with lasting technical updates;
* Major equipment indicators have reached the international advanced level;
* Effectively reduce equipment and packaging costs.

Support process:
Epoxy → SMD (chip flip) → hot press curing. (with foreign countries)

Adapted substrate material:
PET or Paper (same as abroad)

Applicable adhesive materials:
ACA, NCA, ICA (with foreign countries)

The main performance indicators:
*Production efficiency: 1～2 P/S (Foreign 2 P/S)
*Film precision: ±20 μm (±50 μm abroad, more than abroad)
* Bonding temperature: ±0.5 °C (±3 °C abroad, exceeding foreign countries)
* Bonding pressure control: 1.6 ~ 6.4 N (3 ~ 9N abroad, the same level)

Technological innovation:
Integrated vision-guided motion control, force control, thermal control, non-Newtonian fluid control, etc., to achieve comprehensive optimization of performance indicators such as productivity, precision, temperature control, pressure tension control, and reliability.

Reprinted from: China Labeling and Labeling